The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 04, 2020

Filed:

Oct. 17, 2017
Applicant:

Infineon Technologies Ag, Neubiberg, DE;

Inventors:

Sebastian Schmidt, Munich, DE;

Donald Dibra, Munich, DE;

Oliver Hellmund, Neubiberg, DE;

Peter Irsigler, Obernberg/Inn, AT;

Andreas Meiser, Sauerlach, DE;

Hans-Joachim Schulze, Taufkirchen, DE;

Martina Seider-Schmidt, Munich, DE;

Robert Wiesner, Bad Aibling, DE;

Assignee:

Infineon Technologies AG, Neubiberg, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/06 (2006.01); H01L 21/02 (2006.01); H01L 21/265 (2006.01); H01L 21/762 (2006.01); H01L 21/84 (2006.01); H01L 27/12 (2006.01);
U.S. Cl.
CPC ...
H01L 29/0649 (2013.01); H01L 21/02164 (2013.01); H01L 21/02236 (2013.01); H01L 21/02532 (2013.01); H01L 21/26533 (2013.01); H01L 21/76267 (2013.01); H01L 21/76283 (2013.01); H01L 21/84 (2013.01); H01L 27/1203 (2013.01); H01L 21/02255 (2013.01);
Abstract

In accordance with an embodiment of an integrated circuit, a cavity is buried in a semiconductor body below a first surface of the semiconductor body. An active area portion of the semiconductor body is arranged between the first surface and the cavity. The integrated circuit further includes a trench isolation structure configured to provide a lateral electric isolation of the active area portion.


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