The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 04, 2020
Filed:
May. 20, 2016
Sj Semiconductor (Jiangyin) Corporation, Jiangyin, CN;
Yuedong Qiu, Jiangyin, CN;
Chengchung Lin, Jiangyin, CN;
SJ SEMICONDUCTOR (JIANGYIN) CORPORATION, JiangYin, CN;
Abstract
The method of chip packaging comprises: S: providing a carrier, and forming an adhesive layer on a surface of the carrier; S: forming a first dielectric layer on a surface of the adhesive layer, and forming a plurality of first through holes corresponding to electrical leads of a semiconductor chip in the dielectric layer; S: attaching the semiconductor chip with the front surface facing downwards to the surface of the first dielectric layer; S: forming a plastic encapsulation layer covering the chip on the surface of the first dielectric layer; S: separating the adhesive layer and the first dielectric layer to remove the carrier and the adhesive layer; and S: forming a redistribution layer for the semiconductor chip based on the first dielectric layer and the first through holes.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile