The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 28, 2020

Filed:

Jan. 15, 2019
Applicant:

Micron Technology, Inc., Boise, ID (US);

Inventors:

Guangjun Yang, Boise, ID (US);

Suraj J. Mathew, Boise, ID (US);

Assignee:

Micron Technology, Inc., Boise, ID (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/108 (2006.01); H01L 21/768 (2006.01);
U.S. Cl.
CPC ...
H01L 27/10855 (2013.01); H01L 21/76831 (2013.01); H01L 27/10814 (2013.01); H01L 27/10826 (2013.01); H01L 21/76805 (2013.01);
Abstract

Some embodiments include an integrated assembly having active-region-pillars extending upwardly from a base. Each of the active-region-pillars has a pair of storage-element-contact-regions, and a digit-line-contact-region between the storage-element-contact-regions. The integrated assembly includes, along a cross-section, a first digit-line-contact-region adjacent a first storage-element-contact-region. The first digit-line-contact-region is recessed relative to the first storage-element-contact-region. A first digit-line is coupled with the first digit-line-contact-region. A second digit-line is laterally offset from the first digit-line. An insulative material is between the first digit-line and the first storage-element-contact-region. A cup-shaped indentation extends into the insulative material and the first storage-element-contact-region. Insulative spacers are along sidewalls of the first and second digit-lines, and include first material. First and second insulative pillars are over the first and second digit-lines, and include second material. Some embodiments include methods of forming integrated assemblies.


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