The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 28, 2020

Filed:

Nov. 15, 2017
Applicant:

Applied Materials, Inc., Santa Clara, CA (US);

Inventors:

Eric J. Bergman, Kalispell, MT (US);

John L. Klocke, Kalispell, MT (US);

Paul McHugh, Kalispell, MT (US);

Stuart Crane, Kalispell, MT (US);

Richard W. Plavidal, Kalispell, MT (US);

Assignee:

Applied Materials, Inc., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/67 (2006.01); C11D 7/26 (2006.01); H01L 21/02 (2006.01); B08B 3/04 (2006.01);
U.S. Cl.
CPC ...
H01L 21/67034 (2013.01); C11D 7/261 (2013.01); C11D 7/264 (2013.01); H01L 21/02057 (2013.01); B08B 3/04 (2013.01);
Abstract

Methods of drying a semiconductor substrate may include applying a drying agent to a semiconductor substrate, where the drying agent wets the semiconductor substrate. The methods may include heating a chamber housing the semiconductor substrate to a temperature above an atmospheric pressure boiling point of the drying agent until a vapor-liquid equilibrium of the drying agent within the chamber has been reached. The methods may further include venting the chamber, where the venting vaporizes the liquid phase of the drying agent from the semiconductor substrate.


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