The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 28, 2020

Filed:

Apr. 04, 2019
Applicant:

Micron Technology, Inc., Boise, ID (US);

Inventors:

Jian Zhou, Boise, ID (US);

Hongqi Li, Boise, ID (US);

James A. Cultra, Boise, ID (US);

Assignee:

Micron Technology, Inc., Boise, ID (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B24B 37/013 (2012.01); B24B 37/04 (2012.01); B24B 37/10 (2012.01); B24B 49/10 (2006.01); B24B 57/02 (2006.01); G01N 21/31 (2006.01); H01L 21/306 (2006.01); H01L 21/66 (2006.01);
U.S. Cl.
CPC ...
B24B 37/013 (2013.01); B24B 37/042 (2013.01); B24B 37/105 (2013.01); B24B 49/10 (2013.01); B24B 57/02 (2013.01); G01N 21/3103 (2013.01); H01L 21/30625 (2013.01); H01L 22/26 (2013.01);
Abstract

Some embodiments include an apparatus having a polishing mechanism configured to polish a surface of a wafer. The polishing mechanism converts fresh slurry to used slurry during a polishing process. At least one emitter is configured to direct electromagnetic radiation onto or through the used slurry. At least one detector is configured to detect transmittance of the electromagnetic radiation through the used slurry or reflection of the electromagnetic radiation from the used slurry. An identification system is coupled with the at least one detector and is configured to identify a property of the used slurry indicating that an endpoint of the polishing process has been reached. Control circuitry is coupled with the identification system and is configured to stop the polishing process based on receiving a trigger from the identification system. Some embodiments include polishing methods.


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