The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 28, 2020
Filed:
Jun. 28, 2017
Stmicroelectronics, Inc., Coppell, TX (US);
Stmicroelectronics S.r.l., Agrate Brianza, IT;
Stmicroelectronics International N.v., Amsterdam, NL;
Simon Dodd, West Linn, OR (US);
Joe Scheffelin, San Diego, CA (US);
Dave Hunt, San Diego, CA (US);
Matt Giere, San Diego, CA (US);
Dana Gruenbacher, Fairfield, OH (US);
Faiz Sherman, Mason, OH (US);
STMicroelectronics, Inc., Coppell, TX (US);
STMICROELECTRONICS S.R.L., Agrate Brianza, IT;
STMicroelectronics International N.V., Amsterdam, NL;
Abstract
A microfluidic die is disclosed that includes a plurality of heaters above a substrate, a plurality of chambers and nozzles above the heaters, a plurality of first contacts coupled to the heaters, and a plurality of second contacts coupled to the heaters. The plurality of second contacts are coupled to each other and coupled to ground. The die includes a plurality of contact pads, a first signal line coupled to the plurality of second contacts and to a first one of the plurality of contact pads, and a plurality of second signal lines, each second signal line being coupled to one of the plurality of first contacts, groups of the second signal lines being coupled together to drive a group of the plurality of heaters with a single signal, each group of the second signal lines being coupled to a remaining one of the plurality of contact pads.