The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 14, 2020

Filed:

Feb. 19, 2018
Applicant:

Indian Institute of Science, Bangalore, IN;

Inventors:

Mayank Shrivastava, Bangalore, IN;

Milova Paul, Bangalore, IN;

Harald Gossner, Riemerling, DE;

Assignee:

INDIAN INSTITUTE OF SCIENCE, Karnataka, Bangalore, IN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/74 (2006.01); H01L 27/02 (2006.01); H01L 29/06 (2006.01); H01L 29/08 (2006.01); H01L 29/66 (2006.01); H01L 29/45 (2006.01); H01L 29/78 (2006.01); H01L 21/285 (2006.01);
U.S. Cl.
CPC ...
H01L 29/742 (2013.01); H01L 27/0262 (2013.01); H01L 29/068 (2013.01); H01L 29/083 (2013.01); H01L 29/0808 (2013.01); H01L 29/66378 (2013.01); H01L 29/66393 (2013.01); H01L 29/7424 (2013.01); H01L 29/7436 (2013.01); H01L 21/28518 (2013.01); H01L 29/456 (2013.01); H01L 29/785 (2013.01);
Abstract

SCRs are a must for ESD protection in low voltage—high speed I/O as well as ESD protection of RF pads due to least parasitic loading and smallest foot print offered by SCRs. However, conventionally designed SCRs in FinFET and Nanowire technology suffer from very high turn-on and holding voltage. This issue becomes more severe in sub-14 nm non-planar technologies and cannot be handled by conventional approaches like diode- or transient-turn-on techniques. Proposed invention discloses SCR concept for FinFET and Nanowire technology with diffused junction profiles with sub-3V trigger and holding voltage for efficient and robust ESD protection. Besides low trigger and holding voltage, the proposed device offers a 3 times better ESD robustness per unit area.


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