The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 14, 2020
Filed:
Sep. 25, 2015
Shin-etsu Handotai Co., Ltd., Tokyo, JP;
Fujikoshi Machinery Corp., Nagano-shi, Nagano, JP;
Michito Sato, Nishigo-mura, JP;
Junichi Ueno, Shirakawa, JP;
Kaoru Ishii, Shirakawa, JP;
Hiromi Kishida, Chikuma, JP;
Yuya Nakanishi, Nagano, JP;
Ryosuke Yoda, Nagano, JP;
Yosuke Kanai, Nagano, JP;
SHIN-ETSU HANDOTAI CO., LTD., Tokyo, JP;
FUJIKOSHI MACHINERY CORP., Nagano, JP;
Abstract
A polishing apparatus which is an index system polishing apparatus which includes a polishing head for holding a wafer, a plurality of turn tables to which polishing pads for polishing the wafer are attached, and a loading/unloading stage for loading the wafer to the polishing head or unloading the wafer from the polishing head, and which polishes the wafer while switching the turn tables to be used for polishing the wafer held at the polishing head by causing the polishing head to perform rotation movement, the polishing apparatus including a turn table upward and downward movement mechanism which allows the turn table to move upward and downward. With this polishing apparatus, it is possible to reduce an amount of displacement caused when moment load is applied on the polishing head during polishing.