The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 07, 2020

Filed:

Feb. 22, 2016
Applicant:

Nexperia B.v., Nijmegen, NL;

Inventors:

Shun Tik Yeung, Hong Kong, HK;

Pompeo Umali, Kwai Chung, HK;

Hans-Juergen Funke, Luebeck, DE;

Chi Ho Leung, Kwun Tong, HK;

Wolfgang Schnitt, Hamburg, DE;

Zhihao Pan, Hamburg, DE;

Assignee:

Nexperia B.V., Nijmegen, NL;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/10 (2006.01); H01L 23/34 (2006.01); H01L 23/495 (2006.01); H01L 23/367 (2006.01); H01L 27/02 (2006.01); H01L 21/78 (2006.01); H01L 23/00 (2006.01); H01L 25/075 (2006.01); H01L 23/433 (2006.01); H01L 23/492 (2006.01); H01L 33/00 (2010.01); H01L 33/64 (2010.01); H01L 23/31 (2006.01);
U.S. Cl.
CPC ...
H01L 23/3675 (2013.01); H01L 21/78 (2013.01); H01L 23/4334 (2013.01); H01L 23/492 (2013.01); H01L 24/37 (2013.01); H01L 24/92 (2013.01); H01L 24/97 (2013.01); H01L 25/0753 (2013.01); H01L 27/0255 (2013.01); H01L 23/3107 (2013.01); H01L 24/29 (2013.01); H01L 24/32 (2013.01); H01L 24/73 (2013.01); H01L 24/83 (2013.01); H01L 33/0075 (2013.01); H01L 33/647 (2013.01); H01L 2224/2929 (2013.01); H01L 2224/29101 (2013.01); H01L 2224/37147 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/48465 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/8385 (2013.01); H01L 2224/83192 (2013.01); H01L 2224/83455 (2013.01); H01L 2224/83801 (2013.01); H01L 2224/8485 (2013.01); H01L 2224/84801 (2013.01); H01L 2224/922 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/0781 (2013.01); H01L 2924/12036 (2013.01); H01L 2924/13091 (2013.01);
Abstract

A semiconductor device and a method of making the same. The device includes an electrically conductive heat sink having a first surface. The device also includes a semiconductor substrate. The device further includes a first contact located on a first surface of the substrate. The device also includes a second contact located on a second surface of the substrate. The first surface of the substrate is mounted on the first surface of the heat sink for electrical and thermal conduction between the heat sink and the substrate via the first contact. The second surface of the substrate is mountable on a surface of a carrier.


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