The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 07, 2020

Filed:

Apr. 27, 2018
Applicant:

Kla-tencor Corporation, Milpitas, CA (US);

Inventor:

Hari Pathangi Sriraman, Chennai, IN;

Assignee:

KLA-Tencor Corporation, Milpitas, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01J 37/22 (2006.01); G01B 15/00 (2006.01); H01J 37/28 (2006.01); G06T 7/00 (2017.01); G06N 20/00 (2019.01);
U.S. Cl.
CPC ...
H01J 37/222 (2013.01); G01B 15/00 (2013.01); G06N 20/00 (2019.01); G06T 7/0004 (2013.01); G06T 7/97 (2017.01); H01J 37/28 (2013.01); G06T 2207/10061 (2013.01); G06T 2207/20081 (2013.01); G06T 2207/20216 (2013.01);
Abstract

Methods and systems for quantifying and correcting for non-uniformities in images used for metrology operations are disclosed. A metrology area image of a wafer and a design clip may be used. The metrology area image may be a scanning electron microscope image. The design clip may be the design clip of the wafer or a synthesized design clip. Tool distortions, including electron beam distortions, can be quantified and corrected. The design clip can be applied to the metrology area image to obtain a synthesized image such that one or more process change variations are suppressed and one or more tool distortions are enhanced.


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