The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 07, 2020

Filed:

Mar. 12, 2018
Applicant:

Aixtron SE, Herzogenrath, DE;

Inventors:

Stephen E. Savas, Pleasanton, CA (US);

Carl Galewski, Santa Cruz, CA (US);

Hood Chatham, Scotts Valley, CA (US);

Sai Mantripragada, Fremont, CA (US);

Allan Wiesnoski, Pleasanton, CA (US);

Sooyun Joh, Fremont, CA (US);

Assignee:

AIXTRON SE, Herzogenrath, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C23C 16/509 (2006.01); G02B 1/18 (2015.01); H01L 21/02 (2006.01); C23C 16/54 (2006.01); H01J 37/32 (2006.01); C23C 16/458 (2006.01); C23C 16/34 (2006.01); C23C 16/40 (2006.01); C23C 16/44 (2006.01); C23C 16/455 (2006.01); G02B 1/11 (2015.01); G02B 1/14 (2015.01); H01L 51/52 (2006.01);
U.S. Cl.
CPC ...
C23C 16/509 (2013.01); C23C 16/345 (2013.01); C23C 16/401 (2013.01); C23C 16/4412 (2013.01); C23C 16/458 (2013.01); C23C 16/45563 (2013.01); C23C 16/45574 (2013.01); C23C 16/545 (2013.01); G02B 1/11 (2013.01); G02B 1/18 (2015.01); H01J 37/32036 (2013.01); H01J 37/32568 (2013.01); H01L 21/0217 (2013.01); H01L 21/02126 (2013.01); H01L 21/02274 (2013.01); G02B 1/14 (2015.01); H01J 2237/332 (2013.01); H01L 51/5253 (2013.01);
Abstract

A method and apparatus are provided for plasma-based processing of a substrate based on a plasma source having a first, second and third electrodes disposed above a pedestal. The second electrode is disposed between the first and third electrodes. A first gap is formed between the first electrode and the pedestal and between the third electrode and the pedestal. A second gap is formed between the first and second electrodes, and a third gap is formed between the second and third electrodes. A first radio frequency (RF) power supply is connected to the first and third electrodes and is configured to predominantly deliver power to plasmas located in the first gap. A second RF power supply is connected to the second electrode and is configured to predominantly deliver power to plasmas located in the second and third gaps. In such a configuration, the power density of the plasmas located in the first gap can be independently controlled relative to the power density of the plasmas located in the second and third gaps.


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