The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 31, 2019

Filed:

Aug. 29, 2016
Applicant:

Tokyo Electron Limited, Minato-ku, Tokyo, JP;

Inventor:

Mirko Vukovic, Slingerlands, NY (US);

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/687 (2006.01); H01P 1/38 (2006.01); H01P 1/18 (2006.01); H01P 3/12 (2006.01); H01P 7/06 (2006.01); H01L 21/324 (2006.01); H01Q 13/22 (2006.01); H01Q 21/00 (2006.01); H01L 21/67 (2006.01);
U.S. Cl.
CPC ...
H01L 21/68714 (2013.01); H01L 21/324 (2013.01); H01L 21/67115 (2013.01); H01P 1/182 (2013.01); H01P 1/38 (2013.01); H01P 3/12 (2013.01); H01P 7/06 (2013.01); H01Q 13/22 (2013.01); H01Q 21/0043 (2013.01);
Abstract

A processing system is disclosed, having a process chamber that houses a substrate for exposure of a surface of the substrate to a travelling electromagnetic (EM) wave. The processing system also includes an EM wave transmission antenna configured to launch the travelling EM wave into the process chamber for the travelling EM wave to propagate in a direction substantially parallel to the surface of the substrate. The processing system also includes a power coupling system configured to supply EM energy into the EM wave transmission antenna to generate the travelling EM wave at a prescribed output power and in a prescribed EM wave mode during treatment of the substrate. The EM wave is recycled in the processing system in order to increase the efficiency of the microwave power use and eliminate the complexity of the resistive load cooling.


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