The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 31, 2019

Filed:

Apr. 04, 2018
Applicant:

Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu, TW;

Inventors:

Chung-Ming Wang, Chiayi, TW;

Chih-Hsiung Peng, Miaoli County, TW;

Chi-Kang Chang, New Taipei, TW;

Kuei-Shun Chen, Hsinchu, TW;

Shih-Chi Fu, Hsinchu County, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06F 17/50 (2006.01); H01L 27/088 (2006.01); H01L 29/06 (2006.01); H01L 21/8234 (2006.01); H01L 27/02 (2006.01);
U.S. Cl.
CPC ...
G06F 17/5068 (2013.01); H01L 21/823431 (2013.01); H01L 27/0207 (2013.01); H01L 27/0886 (2013.01); H01L 29/0653 (2013.01); G06F 17/5081 (2013.01); G06F 2217/02 (2013.01);
Abstract

A semiconductor device includes a first active fin on a substrate; a second active fin on the substrate and separate from the first active fin; a first fin stub on the substrate, wherein the first fin stub connects a bottom portion of the first active fin and a bottom portion of the second active fin; and an isolation feature over the first fin stub and between the first and second active fins. The first fin stub is lower than both the first and the second active fins in height. The isolation feature is higher than the first fin stub and lower than both the first and the second active fins in height. From a top view, the first active fin is oriented lengthwise in a first direction, and the first fin stub is oriented lengthwise in a second direction that is different from the first direction.


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