The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 31, 2019

Filed:

Aug. 09, 2017
Applicant:

Jsr Corporation, Tokyo, JP;

Inventors:

Masayuki Miyake, Tokyo, JP;

Goji Wakamatsu, Tokyo, JP;

Tsubasa Abe, Tokyo, JP;

Kazunori Takanashi, Tokyo, JP;

Kazunori Sakai, Tokyo, JP;

Assignee:

JSR CORPORATION, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G03F 7/09 (2006.01); G03F 7/40 (2006.01); G03F 7/38 (2006.01); C08G 8/20 (2006.01); G03F 7/004 (2006.01); G03F 7/11 (2006.01); H01L 21/02 (2006.01); H01L 21/027 (2006.01); H01L 21/033 (2006.01); H01L 21/768 (2006.01); C09D 161/06 (2006.01); C09D 161/12 (2006.01); C09D 161/14 (2006.01);
U.S. Cl.
CPC ...
G03F 7/094 (2013.01); C08G 8/20 (2013.01); C09D 161/06 (2013.01); C09D 161/12 (2013.01); C09D 161/14 (2013.01); G03F 7/0048 (2013.01); G03F 7/11 (2013.01); G03F 7/38 (2013.01); G03F 7/40 (2013.01); H01L 21/0271 (2013.01); H01L 21/0273 (2013.01); H01L 21/02118 (2013.01); H01L 21/0332 (2013.01); H01L 21/76886 (2013.01);
Abstract

A resist underlayer film-forming composition includes a solvent, and a compound comprising an aromatic ring. The solvent includes a first solvent having a normal boiling point of less than 156° C., and a second solvent having a normal boiling point of no less than 156° C. and less than 300° C. The resist underlayer film-forming composition is for use in forming a resist underlayer film to be overlaid on a patterned substrate. A production method of a patterned substrate includes applying the resist underlayer film-forming composition on a patterned substrate to obtain a coating film on the patterned substrate. The coating film is heated to obtain a resist underlayer film. A resist pattern is formed on an upper face side of the resist underlayer film. The resist underlayer film and the substrate are etched using the resist pattern as a mask.


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