The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 31, 2019

Filed:

Nov. 13, 2017
Applicant:

Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;

Inventors:

Chui-Jung Chiu, Zhubei, TW;

Jen-Chieh Lo, New Taipei, TW;

Ying-Chou Cheng, Zhubei, TW;

Ru-Gun Liu, Zhubei, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01B 15/04 (2006.01); G01B 15/00 (2006.01); H01J 37/28 (2006.01);
U.S. Cl.
CPC ...
G01B 15/04 (2013.01); G01B 15/00 (2013.01); H01J 37/28 (2013.01); G05B 2219/37127 (2013.01); G05B 2219/37224 (2013.01);
Abstract

A method includes receiving, into a measurement tool, a substrate having a material feature, wherein the material feature is formed on the substrate according to a design feature. The method further includes applying a source signal on the material feature, collecting a response signal from the material feature by using a detector in the measurement tool to obtain measurement data, and with a computer connected to the measurement tool, calculating a simulated response signal from the design feature. The method further includes, with the computer, in response to determining that a difference between the collected response signal and the simulated response signal exceeds a predetermined value, causing the measurement tool to re-measure the material feature.


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