The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 24, 2019

Filed:

Oct. 06, 2015
Applicant:

Sumco Corporation, Tokyo, JP;

Inventors:

Takeshi Hirose, Tokyo, JP;

Masayuki Tsuji, Tokyo, JP;

Fumihiko Kimura, Nagasaki, JP;

Assignee:

SUMCO CORPORATION, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C30B 25/12 (2006.01); H01L 21/02 (2006.01); C30B 29/06 (2006.01);
U.S. Cl.
CPC ...
C30B 25/12 (2013.01); C30B 29/06 (2013.01); H01L 21/02381 (2013.01); H01L 21/02433 (2013.01); H01L 21/02532 (2013.01);
Abstract

A manufacturing method of an epitaxial silicon wafer, using an epitaxial growth apparatus including a susceptor and a heat ring, includes: determining a surface position of a silicon wafer to be higher than a surface position of a peripheral portion of the susceptor and to be lower than a surface position of the heat ring; and adjusting a gap between the surface position of the silicon wafer and the surface position of the heat ring to control a difference between a film thickness of the epitaxial layer formed on a peripheral portion in a <110> orientation of the silicon wafer and a film thickness of the epitaxial layer formed on the peripheral portion in a <100> orientation of the silicon wafer.


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