The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 17, 2019

Filed:

Sep. 24, 2015
Applicant:

Tokyo Electron Limited, Tokyo, JP;

Inventors:

Yuki Hosaka, Miyagi, JP;

Yoshihiro Umezawa, Miyagi, JP;

Mayo Uda, Miyagi, JP;

Takashi Kubo, Miyagi, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
F16K 3/08 (2006.01); H01J 37/32 (2006.01); H01L 21/3065 (2006.01); C23C 16/455 (2006.01); F16K 31/04 (2006.01); H01L 21/67 (2006.01);
U.S. Cl.
CPC ...
H01J 37/32449 (2013.01); C23C 16/45587 (2013.01); F16K 3/08 (2013.01); F16K 3/085 (2013.01); F16K 31/041 (2013.01); H01J 37/3244 (2013.01); H01L 21/3065 (2013.01); H01L 21/67069 (2013.01); H01J 37/32091 (2013.01); H01J 37/32183 (2013.01); H01J 2237/332 (2013.01); H01J 2237/334 (2013.01);
Abstract

According to an aspect, a gas supply mechanism for supplying a gas to a semiconductor manufacturing apparatus is provided. The gas supply mechanism includes a pipe connecting a gas source and the semiconductor manufacturing apparatus to each other, and a valve which is provided on the pipe. The valve includes a plate rotatable about an axis, the axis extending in a plate thickness direction, and a housing provided along the plate without contacting the plate to accommodate the plate, the housing providing a gas supply path along with the pipe. A through hole is formed in the plate, the through hole penetrating the plate at a position on a circle which extends around the axis and intersects the gas supply path.


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