The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 17, 2019
Filed:
Jan. 20, 2017
Applicant:
Taiwan Semiconductor Manufacturing Co., Ltd, Hsinchu, TW;
Inventors:
Tsai-Hao Hung, Hsinchu, TW;
Shih-Chi Kuo, Taoyuan, TW;
Tsung-Hsien Lee, Tainan, TW;
Tao-Cheng Liu, Hsinchu, TW;
Assignee:
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD., Hsinchu, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B81B 1/00 (2006.01); B81C 1/00 (2006.01);
U.S. Cl.
CPC ...
B81B 1/004 (2013.01); B81C 1/00087 (2013.01); B81B 2203/0127 (2013.01); B81B 2203/0163 (2013.01); B81B 2203/0315 (2013.01); B81B 2203/04 (2013.01); B81C 2201/0104 (2013.01); B81C 2201/0108 (2013.01); B81C 2201/0132 (2013.01); B81C 2203/0118 (2013.01);
Abstract
The present disclosure provides a substrate structure for a micro electro mechanical system (MEMS) device. The substrate structure includes a cap and a micro electro mechanical system (MEMS) substrate. The cap has a cavity, and the MEMS substrate is disposed on the cap. The MEMS substrate has a plurality of through holes exposing the cavity, and an aspect ratio of the through hole is greater than 30.