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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10507563 B1

PDFFull Text
Date of Patent:
Dec. 17, 2019

Filed:

Mar. 30, 2016

Treatment composition for chemical mechanical polishing, chemical mechanical polishing method, and cleaning method

Applicant:

Jsr Corporation, Minato-ku, JP;

Inventors:

Kiyotaka Mitsumoto, Minato-ku, JP;

Tatsuyoshi Kawamoto, Minato-ku, JP;

Tatsuya Yamanaka, Minato-ku, JP;

Megumi Arakawa, Minato-ku, JP;

Eiichirou Kunitani, Minato-ku, JP;

Masashi Iida, Minato-ku, JP;

Assignee:

JSR CORPORATION, Minato-ku, JP;

Attorney:

Oblon, McClelland, Maier & Neustadt, L.L.P.

Primary Examiner:

Timothy V Eley

Int. Cl.
CPC ...
B24B 37/00 (2012.01); H01L 21/304 (2006.01); C09G 1/02 (2006.01); C09G 1/04 (2006.01); C11D 1/14 (2006.01); C11D 1/22 (2006.01); C11D 1/34 (2006.01); C11D 3/14 (2006.01); C11D 3/30 (2006.01); C11D 3/33 (2006.01); H01L 21/02 (2006.01); H01L 21/321 (2006.01); C11D 3/37 (2006.01); B24B 37/24 (2012.01); B24B 7/22 (2006.01); C11D 1/08 (2006.01); C11D 1/90 (2006.01); H01L 21/768 (2006.01); C11D 3/28 (2006.01); C11D 7/32 (2006.01); C11D 11/00 (2006.01); B24B 37/04 (2012.01);
U.S. Cl.
CPC ...
B24B 37/24 (2013.01); B24B 7/228 (2013.01); B24B 37/00 (2013.01); B24B 37/044 (2013.01); C09G 1/02 (2013.01); C09G 1/04 (2013.01); C11D 1/08 (2013.01); C11D 1/143 (2013.01); C11D 1/22 (2013.01); C11D 1/345 (2013.01); C11D 1/90 (2013.01); C11D 3/14 (2013.01); C11D 3/28 (2013.01); C11D 3/30 (2013.01); C11D 3/33 (2013.01); C11D 3/3765 (2013.01); C11D 7/3209 (2013.01); C11D 7/3245 (2013.01); C11D 7/3281 (2013.01); C11D 11/0047 (2013.01); H01L 21/02074 (2013.01); H01L 21/304 (2013.01); H01L 21/3212 (2013.01); H01L 21/7684 (2013.01);
Abstract

Provided is a treatment composition for chemical mechanical polishing, for treating an object to be treated including a wiring layer containing a metal, the treatment composition for chemical mechanical polishing containing: (A) a nitrogen-containing compound; (B) at least one kind of compound selected from the group consisting of a surfactant and polyacrylic acid; and (D) a pH adjusting agent, in which in terms of electrode charge transfer resistance value obtained by AC impedance measurement using the metal for an electrode, a sum of electrode charge transfer resistance values RA+RB in aqueous solutions each containing the component (A) or (B) and the component (D), and an electrode charge transfer resistance value RC in an aqueous solution containing the components (A), (B), and (D) have a relationship of RC/(RA+RB)>1.

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