The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 10, 2019

Filed:

Apr. 24, 2017
Applicant:

Applied Materials, Inc., Santa Clara, CA (US);

Inventors:

Kartik Ramaswamy, San Jose, CA (US);

Anwar Husain, Pleasanton, CA (US);

Haitao Wang, Fremont, CA (US);

Evans Yip Lee, Milpitas, CA (US);

Jaeyong Cho, San Jose, CA (US);

Hamid Noorbakhsh, Oakland, CA (US);

Kenny L. Doan, San Jose, CA (US);

Sergio Fukuda Shoji, San Jose, CA (US);

Chunlei Zhang, Santa Clara, CA (US);

Assignee:

Applied Materials, Inc., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 21/683 (2006.01); H01L 21/687 (2006.01);
U.S. Cl.
CPC ...
H01L 21/6833 (2013.01); H01L 21/68757 (2013.01); H01J 2237/20 (2013.01);
Abstract

Embodiments include an electrostatic chuck assembly having an electrostatic chuck mounted on an insulator. The electrostatic chuck and insulator may be within a chamber volume of a process chamber. In an embodiment, a ground shield surrounds the electrostatic chuck and the insulator, and a gap between the ground shield and the electrostatic chuck provides an environment at risk for electric field emission. A dielectric filler can be placed within the gap to reduce a likelihood of electric field emission. The dielectric filler can have a flexible outer surface that covers or attaches to the electrostatic chuck, or an interface between the electrostatic chuck and the insulator Other embodiments are also described and claimed.


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