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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10504737 B1

PDFFull Text
Date of Patent:
Dec. 10, 2019

Filed:

Aug. 25, 2017

Methods of enhancing surface topography on a substrate for inspection

Applicant:

Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;

Inventors:

Han-Wen Liao, Taichung, TW;

Jun Xiu Liu, Taichung, TW;

Chun-Chih Lin, Taipei, TW;

Assignee:

TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD., Hsinchu, TW;

Attorney:

Seed IP Law Group LLP

Primary Examiner:

Binh X Tran

Int. Cl.
CPC ...
H01L 21/306 (2006.01); H01L 21/76 (2006.01); H01L 21/67 (2006.01); H01L 21/762 (2006.01); H01L 21/3105 (2006.01); H01L 21/66 (2006.01); H01L 21/311 (2006.01);
U.S. Cl.
CPC ...
H01L 21/30625 (2013.01); H01L 21/31053 (2013.01); H01L 21/67288 (2013.01); H01L 21/76 (2013.01); H01L 21/76224 (2013.01); H01L 22/12 (2013.01); H01L 22/20 (2013.01); H01L 22/24 (2013.01); H01L 21/30608 (2013.01); H01L 21/31111 (2013.01);
Abstract

Methods for enhancing a surface topography of a structure formed on a substrate are provided. In one example, the method includes performing a polishing process on a substrate having a shallow trench isolation structure and a diffusion region, performing a surface topography enhancing process to enlarge a defect in at least one of the shallow trench isolation structure and the diffusion region, inspecting at least one of the shallow trench isolation structure and the diffusion region to detect the enlarged defect, and adjusting a parameter of the polishing process in response to detecting the enlarged defect.

Find Patent Forward Citations

Liao, Han-Wen. (2019). Methods of enhancing surface topography on a substrate for inspection (U.S. Patent No. 10504737). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10504737

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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