The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 10, 2019
Filed:
Aug. 22, 2012
Mamoru Kosakai, Tokyo, JP;
Kazunori Ishimura, Tokyo, JP;
Takeshi Watanabe, Tokyo, JP;
Hitoshi Kouno, Tokyo, JP;
Ryuuji Hayahara, Tokyo, JP;
Mamoru Kosakai, Tokyo, JP;
Kazunori Ishimura, Tokyo, JP;
Takeshi Watanabe, Tokyo, JP;
Hitoshi Kouno, Tokyo, JP;
Ryuuji Hayahara, Tokyo, JP;
SUMITOMO OSAKA CEMENT CO., LTD., Tokyo, JP;
Abstract
A plate-shaped body for temperature measurement which, simply by being mounted on a mounting surface of an electrostatic chuck apparatus and without using a semiconductor wafer itself, is able to easily optimize the in-plane temperature distribution of the mounting surface of the electrostatic chuck apparatus, the temperature rising characteristics, and the cooling characteristics during decreases in temperature. In such plate-shaped body for temperature measurement (), an insulating adhesive () is bonded to the entirety of a surface () of a wafer (), a heater element () is provided on the insulating adhesive (), a temperature measurement region () is provided used to measure the temperature of the surface () of the wafer () in a region excluding the heater element () on the surface () of the insulating adhesive (), and the heater element () and the temperature measurement region () are coated with an insulating film ().