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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10497667 B1

PDFFull Text
Date of Patent:
Dec. 03, 2019

Filed:

Mar. 26, 2018

Apparatus for bond wave propagation control

Applicant:

Taiwan Semiconductor Manufacturing Co., Ltd., Hsin-Chu, TW;

Inventors:

Xin-Hua Huang, Xihu Township, TW;

Kuan-Liang Liu, Pingtung, TW;

Kuo Liang Lu, Hsinchu, TW;

Ping-Yin Liu, Yonghe, TW;

Assignee:

Taiwan Semiconductor Manufacturing Co., Ltd., Hsin-Chu, TW;

Attorney:

Eschweiler & Potashnik, LLC

Primary Examiner:

Kiley S Stoner

Int. Cl.
CPC ...
B23K 37/04 (2006.01); H01L 23/00 (2006.01); H01L 21/683 (2006.01); H01L 21/67 (2006.01); H01L 21/20 (2006.01); H01L 21/762 (2006.01); B23K 101/40 (2006.01);
U.S. Cl.
CPC ...
H01L 24/94 (2013.01); B23K 37/04 (2013.01); B23K 37/0408 (2013.01); H01L 21/2007 (2013.01); H01L 21/67092 (2013.01); H01L 21/6831 (2013.01); H01L 21/6838 (2013.01); H01L 21/76251 (2013.01); H01L 24/75 (2013.01); H01L 24/83 (2013.01); B23K 2101/40 (2018.08); H01L 2224/753 (2013.01); H01L 2224/759 (2013.01); H01L 2224/75704 (2013.01); H01L 2224/75724 (2013.01); H01L 2224/75744 (2013.01); H01L 2224/83209 (2013.01); H01L 2224/83894 (2013.01); H01L 2224/83908 (2013.01); H01L 2924/1203 (2013.01); H01L 2924/12043 (2013.01); H01L 2924/1304 (2013.01); H01L 2924/1434 (2013.01); H01L 2924/1461 (2013.01);
Abstract

An apparatus and method is provided for controlling a propagation of a bond wave during semiconductor processing. The apparatus has a first chuck to selectively retain a first workpiece. A second chuck selectively retains a second workpiece. The first and second chucks selectively secure at least a periphery of the respective first workpiece and second workpiece. An air vacuum is circumferentially located in a region between the first chuck and second chuck. The air vacuum is configured to induce a vacuum between the first workpiece and second workpiece to selectively bring the first workpiece and second workpiece together from a propagation point. The air vacuum can be localized air vacuum guns, a vacuum disk, or an air curtain positioned about the periphery of the region between the first chuck and second chuck. The air curtain induces a lower pressure within the region between the first and second chucks.

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