The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 03, 2019

Filed:

Feb. 01, 2017
Applicant:

Commissariat a L'energie Atomique ET Aux Energies Alternatives, Paris, FR;

Inventors:

Nicolas Posseme, Sassenage, FR;

Laurent Brunet, Grenoble, FR;

Perrine Batude, Dijon, FR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/8238 (2006.01); H01L 21/02 (2006.01); H01L 21/311 (2006.01); H01L 29/417 (2006.01); H01L 29/66 (2006.01); H01L 29/786 (2006.01);
U.S. Cl.
CPC ...
H01L 21/823814 (2013.01); H01L 21/02115 (2013.01); H01L 21/31111 (2013.01); H01L 29/41783 (2013.01); H01L 29/6656 (2013.01); H01L 29/66575 (2013.01); H01L 29/66636 (2013.01); H01L 29/66772 (2013.01); H01L 29/78618 (2013.01); H01L 29/78654 (2013.01);
Abstract

A method is provided for forming a transistor from a stack including the following successive layers: an electrically insulating layer, an active zone including at least one semiconductor layer, and a gate, sides of which are configured to be covered by at least one spacer, the method including: a phase of forming lateral cavities; and forming a raised drain and a raised source that fill the lateral cavities by growing the semiconductor layer via epitaxy, the forming of the lateral cavities includes, after a step of partially removing the semiconductor layer: forming a sacrificial layer, partially removing the sacrificial layer; forming spacers against the sides of the gate resting on a residual sacrificial layer; and totally removing the residual sacrificial layer in order to form the lateral cavities.


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