The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 03, 2019
Filed:
Sep. 21, 2018
Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;
Chung-Wei Hsu, Hsinchu County, TW;
Yu-Chung Su, Hsinchu, TW;
Chen-Hao Wu, Keelung, TW;
Shen-Nan Lee, Hsinchu County, TW;
Tsung-Ling Tsai, Hsinchu, TW;
Teng-Chun Tsai, Hsinchu, TW;
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD., Hsinchu, TW;
Abstract
A method includes forming a spin-on carbon (SOC) layer over a target structure; chemically treating an upper portion of the SOC layer; forming a sacrificial layer over the SOC layer; performing a chemical mechanical polish (CMP) process on the sacrificial layer until reaching the SOC layer, wherein the chemically treated upper portion of the SOC layer has a higher resistance to the CMP process than that of the sacrificial layer; forming a patterned photoresist layer over the SOC layer after the CMP process; and etching the target structure using the patterned photoresist layer as a mask.