The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 03, 2019
Filed:
Dec. 17, 2018
Applicant:
Taiwan Semiconductor Manufacturing Co., Ltd., Hsin-Chu, TW;
Inventors:
Anthony Lin, Hsin-Chu, TW;
Ching-Lun Lai, Taichung, TW;
Pei-Ren Jeng, Hsinchu County, TW;
Tze-Liang Lee, Hsinchu, TW;
Assignee:
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD., Hsinchu, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C23C 16/455 (2006.01); C23C 16/44 (2006.01); H01L 21/02 (2006.01); C23C 16/458 (2006.01);
U.S. Cl.
CPC ...
C23C 16/45551 (2013.01); C23C 16/4412 (2013.01); C23C 16/4584 (2013.01); C23C 16/45519 (2013.01); C23C 16/45578 (2013.01); H01L 21/0228 (2013.01);
Abstract
A semiconductor fabrication apparatus includes a processing chamber; a wafer stage configured in the processing chamber; a first chemical delivery mechanism configured in the processing chamber to provide a first chemical to a first reaction zone in the processing chamber; and air edge mechanisms configured on both sides of the first reaction zone to isolate the first reaction zone from other reaction zones in the processing chamber.