The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 26, 2019

Filed:

Feb. 13, 2017
Applicant:

Shinkawa Ltd., Tokyo, JP;

Inventors:

Akira Sato, Tokyo, JP;

Kohei Seyama, Tokyo, JP;

Assignee:

SHINKAWA LTD., Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01B 5/24 (2006.01); H05K 13/08 (2006.01); H05K 13/04 (2006.01);
U.S. Cl.
CPC ...
H05K 13/08 (2013.01); G01B 5/24 (2013.01); H05K 13/0404 (2013.01); H05K 13/0812 (2018.08); H05K 13/0813 (2018.08);
Abstract

A mounting apparatus for mounting an electronic component onto a substrate includes: a mounting tool () configured to hold the electronic component by a holding surface () as a tip end surface of the mounting tool; a movement mechanism configured to move the mounting tool () relatively with respect to the substrate; an angle detection mechanism configured to measure an inclination of a planar-plated measurement jig () held by the holding surface (); and a controller configured to control driving of the mounting apparatus, wherein during inspection of the holding surface (), the controller causes the mounting tool () to hold the measurement jig (), and the angle detection mechanism to measure the inclination of the measurement jig (). With this, a mounting apparatus capable of measuring a condition of the holding surface of the mounting tool more correctly is provided.


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