The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 26, 2019

Filed:

Nov. 07, 2017
Applicant:

Macronix International Co., Ltd., Hsinchu, TW;

Inventors:

Dai-Ying Lee, Hsinchu County, TW;

Po-Hao Tseng, Taichung, TW;

Feng-Min Lee, Hsinchu, TW;

Yu-Yu Lin, New Taipei, TW;

Kai-Chieh Hsu, Taoyuan, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 47/00 (2006.01); H01L 45/00 (2006.01); H01L 27/24 (2006.01);
U.S. Cl.
CPC ...
H01L 45/1253 (2013.01); H01L 27/2436 (2013.01); H01L 45/1233 (2013.01); H01L 45/146 (2013.01);
Abstract

A contact hole structure includes a substrate, an interlayer dielectric (ILD), a conductive layer and an insulating capping layer. The ILD is disposed on the substrate and has a first opening. The conductive layer is disposed in the ILD and aligns the first opening. The insulating capping layer has a spacer disposed on a first sidewall of the first opening, wherein the spacer contacts to the conductive layer and defines a second opening in the first opening, so as to expose a portion of the conductive layer.


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