The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 26, 2019

Filed:

Jan. 10, 2019
Applicant:

Semiconductor Components Industries, Llc, Phoenix, AZ (US);

Inventors:

Moshe Agam, Portland, OR (US);

Johan Camiel Julia Janssens, Asse, BE;

Jaroslav Pjencak, Dolni Becva, CZ;

Thierry Yao, Portland, OR (US);

Mark Griswold, Gilbert, AZ (US);

Weize Chen, Phoenix, AZ (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 27/07 (2006.01); H01L 27/088 (2006.01); H01L 27/098 (2006.01); H01L 29/739 (2006.01); H01L 29/06 (2006.01); H01L 29/10 (2006.01); H01L 29/66 (2006.01); H01L 29/861 (2006.01); H01L 21/8234 (2006.01); H01L 21/76 (2006.01); H01L 27/02 (2006.01); H01L 21/763 (2006.01); H01L 29/78 (2006.01);
U.S. Cl.
CPC ...
H01L 27/0705 (2013.01); H01L 21/76 (2013.01); H01L 21/763 (2013.01); H01L 21/823481 (2013.01); H01L 27/0248 (2013.01); H01L 27/0711 (2013.01); H01L 27/088 (2013.01); H01L 27/098 (2013.01); H01L 29/0653 (2013.01); H01L 29/1083 (2013.01); H01L 29/66659 (2013.01); H01L 29/7391 (2013.01); H01L 29/861 (2013.01); H01L 29/06 (2013.01); H01L 29/0696 (2013.01); H01L 29/10 (2013.01); H01L 29/1095 (2013.01); H01L 29/78 (2013.01); H01L 29/7835 (2013.01);
Abstract

A semiconductor device includes a floating buried doped region, a first doped region disposed between the floating buried doped region and a first major surface, and a semiconductor region disposed between the floating buried doped region and a second major surface. A trench isolation structure extends from the first major surface and terminates within the semiconductor region and the floating buried doped region abuts the trench isolation structure. A second doped region is disposed in the first doped region has an opposite conductivity type to the first doped region. A first isolation device is disposed in the first doped region and is configured to divert current injected into the semiconductor device from other regions thereby delaying the triggering of an internal SCR structure. In one embodiment, a second isolation structure is disposed within the first doped region and is configured to disrupt a leakage path along a sidewall surface of the trench isolation structure.


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