The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 26, 2019
Filed:
Apr. 17, 2018
Industrial Technology Research Institute, Hsinchu, TW;
INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE, Hsinchu, TW;
Abstract
A chip package module includes an encapsulation layer, a chip, a substrate and a plurality of blind-hole electrodes. The encapsulation layer includes a first surface and a second surface opposite to the first surface. The chip includes a third surface and a fourth surface opposite to the third surface. A metal bump is fabricated on the third surface of the chip. The chip is embedded into the encapsulation layer from the first surface of the encapsulation layer. The metal bump is exposed from the first surface of the encapsulation layer. The substrate includes a metal layer, wherein the metal layer of the substrate is bonded to the chip through the metal bump. The plurality of blind-hole electrodes pass through the second surface of the encapsulation layer and are electrically connected to the metal layer of the substrate.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile