The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 26, 2019
Filed:
Aug. 26, 2016
Applicant:
Hitachi High-technologies Corporation, Tokyo, JP;
Inventors:
Masaki Ishiguro, Tokyo, JP;
Masahiro Sumiya, Tokyo, JP;
Shigeru Shirayone, Tokyo, JP;
Tomoyuki Tamura, Tokyo, JP;
Kazuyuki Ikenaga, Tokyo, JP;
Assignee:
Hitachi High-Technologies Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/3065 (2006.01); H01L 21/67 (2006.01); H01L 21/683 (2006.01); H01J 37/32 (2006.01);
U.S. Cl.
CPC ...
H01L 21/3065 (2013.01); H01J 37/32706 (2013.01); H01J 37/32715 (2013.01); H01J 37/32788 (2013.01); H01L 21/67069 (2013.01); H01L 21/6833 (2013.01);
Abstract
A sample releasing method for releasing a sample subjected to plasma processing from a sample stage on which the sample is electrostatically attracted by applying DC voltage to an electrostatic chuck electrode, and the method includes: moving the sample subjected to the plasma processing upward above the sample stage; and after moving the sample, controlling the DC voltage such that an electric potential of the sample is to be smaller.