IDiyas

For the Inventor, By the Inventor

The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10483198 B1

PDFFull Text
Date of Patent:
Nov. 19, 2019

Filed:

Jul. 09, 2018

Post-grind die backside power delivery

Applicant:

Intel Corporation, Santa Clara, CA (US);

Inventors:

Min-Tih Ted Lai, Folsom, CA (US);

Tyler Leuten, Orangevale, CA (US);

Florence R. Pon, Folsom, CA (US);

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:

Schwegman Lundberg & Woessner, P.A.

Primary Examiner:

Daniel P Shook

Int. Cl.
CPC ...
H01L 23/498 (2006.01); H01L 25/065 (2006.01); H01L 23/522 (2006.01); H01L 23/538 (2006.01); H01L 23/528 (2006.01); H01L 23/50 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49838 (2013.01); H01L 23/5223 (2013.01); H01L 23/5383 (2013.01); H01L 25/0657 (2013.01); H01L 23/50 (2013.01); H01L 23/5222 (2013.01); H01L 23/5286 (2013.01); H01L 2224/04042 (2013.01); H01L 2224/16157 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/16235 (2013.01); H01L 2224/32145 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48145 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/73265 (2013.01); H01L 2225/0651 (2013.01); H01L 2225/06506 (2013.01); H01L 2225/06562 (2013.01); H01L 2924/10253 (2013.01); H01L 2924/15192 (2013.01); H01L 2924/3025 (2013.01);
Abstract

Disclosed is a die. The die may include a material layer, a plurality of vias, and a plurality of metal channels. The material layer may have a top side and a backside. The top side may include a plurality of pad connections. The plurality of vias may extend through the material layer from the top side to the backside. The plurality of metal channels may be in contact with the backside. Each of the plurality of metal channels may be in electrical communication with at least one of the plurality of pad connections and at least one of the plurality of vias.

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