The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 19, 2019
Filed:
Jul. 14, 2017
Applicant:
Tokyo Electron Limited, Tokyo, JP;
Inventors:
Hiroyuki Masutomi, Kumamoto, JP;
Toshiyuki Shiokawa, Kumamoto, JP;
Koji Tanaka, Kumamoto, JP;
Takami Satoh, Kumamoto, JP;
Assignee:
Tokyo Electron Limited, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/67 (2006.01); H01L 21/673 (2006.01); H01L 21/311 (2006.01); G02F 1/1333 (2006.01); H01L 21/8234 (2006.01); G02F 1/13 (2006.01);
U.S. Cl.
CPC ...
H01L 21/67253 (2013.01); H01L 21/6708 (2013.01); H01L 21/67051 (2013.01); H01L 21/67086 (2013.01); H01L 21/67109 (2013.01); H01L 21/67313 (2013.01); G02F 1/1303 (2013.01); G02F 1/1333 (2013.01); H01L 21/31111 (2013.01); H01L 21/823431 (2013.01);
Abstract
The substrate liquid processing apparatus includes a processing bath that accommodates substrates, and a plurality of gas supply pipes provided in a processing bath. Ejection holes of one gas supply pipe and ejection holes of another adjacent gas supply pipe do not overlap each other in a direction parallel to the circuit-formed surfaces of the substrates.