The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 19, 2019

Filed:

Sep. 22, 2016
Applicant:

Tokyo Electron Limited, Tokyo, JP;

Inventors:

Tadahiro Ishizaka, Yamanashi, JP;

Masaki Koizumi, Yamanashi, JP;

Masaki Sano, Yamanashi, JP;

Seokhyoung Hong, Yamanashi, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/02 (2006.01); H01L 21/67 (2006.01); C23C 16/30 (2006.01); C23C 16/455 (2006.01); H01L 27/11582 (2017.01); H01L 49/02 (2006.01);
U.S. Cl.
CPC ...
H01L 21/02186 (2013.01); C23C 16/308 (2013.01); C23C 16/45531 (2013.01); H01L 21/0228 (2013.01); H01L 21/0234 (2013.01); H01L 21/02326 (2013.01); H01L 21/67017 (2013.01); H01L 21/67213 (2013.01); H01L 27/11582 (2013.01); H01L 28/00 (2013.01);
Abstract

A TiON film forming method is provided. A cycle of forming a unit TiN film at a predetermined processing temperature by alternately supplying a Ti-containing gas and a nitriding gas into the processing chamber accommodating a target substrate and oxidizing the unit TiN film by supplying an oxidizing agent into the processing chamber is repeated multiple times. In an initial stage of the film formation, a cycle of repeating the alternate supply of the Ti-containing gas and the nitriding gas X1 times and supplying the oxidizing agent is repeated Y1 times. In a later stage of the film formation, a cycle of repeating the alternate supply of the Ti-containing gas and the nitriding gas X2 times and supplying the oxidizing agent is repeated Y2 times until a desired film thickness is obtained. The number of repetition X1 is set to be greater than the number of repetition X2.


Find Patent Forward Citations

Loading…