The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 12, 2019

Filed:

Jan. 22, 2019
Applicant:

Infineon Technologies Ag, Neubiberg, DE;

Inventors:

Hans-Joachim Schulze, Taufkirchen, DE;

Philip Christoph Brandt, Oberhaching, DE;

Andre Rainer Stegner, Munich, DE;

Assignee:

Infineon Technologies AG, Neubiberg, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/739 (2006.01); H01L 29/66 (2006.01); H01L 29/10 (2006.01); H01L 29/167 (2006.01); H01L 21/22 (2006.01); H01L 21/24 (2006.01); H01L 21/266 (2006.01); H01L 29/18 (2006.01); H01L 21/265 (2006.01); H01L 29/45 (2006.01); H01L 29/06 (2006.01);
U.S. Cl.
CPC ...
H01L 29/7397 (2013.01); H01L 21/22 (2013.01); H01L 21/24 (2013.01); H01L 21/266 (2013.01); H01L 21/26506 (2013.01); H01L 29/1095 (2013.01); H01L 29/167 (2013.01); H01L 29/18 (2013.01); H01L 29/66348 (2013.01); H01L 29/7396 (2013.01); H01L 21/26586 (2013.01); H01L 29/0619 (2013.01); H01L 29/456 (2013.01);
Abstract

Some embodiments relate to a semiconductor device that includes a body region of a field effect transistor structure formed in a semiconductor substrate between a drift region of the field effect transistor structure and a source region of the field effect transistor structure. The semiconductor substrate includes chalcogen atoms at an atom concentration of less than 1×10cmat a p-n junction between the body region and the drift region, and at least part of the source region includes chalcogen atoms at an atom concentration of greater than 1×10cm. Additional semiconductor device embodiments and corresponding methods of manufacture are described.


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