The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 12, 2019
Filed:
Aug. 17, 2017
Advanced Semiconductor Engineering, Inc., Kaohsiung, TW;
Hsu-Nan Fang, Kaohsiung, TW;
Chun-Jun Zhuang, Kaohsiung, TW;
ADVANCED SEMICONDUCTOR ENGINEERING, INC., Kaohsiung, TW;
Abstract
A semiconductor package device comprises a circuit layer, an electronic component disposed on the circuit layer, a package element and a first encapsulant. The package element is disposed on the circuit layer. The package element includes at least two electrical contacts electrically connected to the circuit layer. The first encapsulant is disposed on the circuit layer. The first encapsulant encapsulates the electronic component and the package element and exposes the electrical contacts of the package element.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile