The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 05, 2019

Filed:

Feb. 01, 2018
Applicant:

Globalfoundries Inc., Grand Cayman, KY;

Inventors:

Anthony Kendall Stamper, Burlington, VT (US);

Vibhor Jain, Essex Junction, VT (US);

Humberto Campanella Pineda, Singapore, SG;

John Joseph Pekarik, Underhill, VT (US);

Assignee:

GLOBALFOUNDRIES INC., Grand Cayman, KY;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/06 (2006.01); H03F 3/21 (2006.01); H01L 21/304 (2006.01); H01L 21/8238 (2006.01); H01L 27/02 (2006.01); H01L 21/762 (2006.01); H01L 21/02 (2006.01);
U.S. Cl.
CPC ...
H03F 3/21 (2013.01); H01L 21/0245 (2013.01); H01L 21/02178 (2013.01); H01L 21/02304 (2013.01); H01L 21/3043 (2013.01); H01L 21/762 (2013.01); H01L 21/8238 (2013.01); H01L 27/02 (2013.01);
Abstract

A method of forming a CMOS device and a GaN PA structure on a 100 Si substrate having a surface orientated in 111 direction and the resulting device are provided. Embodiments include forming a device with a protective layer over a portion of a Si substrate; forming a V-shaped groove in the Si substrate; forming a buffer layer, a GaN layer, an AlGaN layer and a passivation layer sequentially over the Si substrate; forming trenches through the passivation and the AlGaN layers; forming second trenches through the passivation layer; forming electrode structures over portions of the passivation layer and filling the first and second trenches; removing portions of the passivation layer, the AlGaN layer and the GaN layer outside of the V-shaped groove down to the buffer layer; forming a dielectric layer over the Si substrate; and forming vias through the dielectric layer down to electrode structures and the device.


Find Patent Forward Citations

Quick Actions:

Stamper, Anthony. (2019). Gallium nitride (gan) power amplifiers (pa) with angled electrodes and 100 cmos and method for producing the same (U.S. Patent No. 10469041). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10469041

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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