The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 05, 2019
Filed:
Mar. 22, 2017
Applicant:
Ebara Corporation, Tokyo, JP;
Inventors:
Assignee:
EBARA CORPORATION, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C25D 5/02 (2006.01); H01L 23/00 (2006.01); C25D 3/38 (2006.01); C25D 5/54 (2006.01); C25D 7/12 (2006.01); C25D 21/10 (2006.01);
U.S. Cl.
CPC ...
H01L 24/11 (2013.01); C25D 3/38 (2013.01); C25D 5/02 (2013.01); C25D 5/54 (2013.01); C25D 7/12 (2013.01); C25D 21/10 (2013.01); H01L 24/94 (2013.01); H01L 24/13 (2013.01); H01L 2224/119 (2013.01); H01L 2224/11462 (2013.01); H01L 2224/13147 (2013.01);
Abstract
A plating method which can achieve a desired dome height is disclosed. The method includes: preparing correlation data showing a relationship between proportion of dome height to bump height and concentration of chloride ions; producing a plating solution containing chloride ions at a concentration which has been selected based on a desired proportion of dome height to bump height and on the correlation data, the selected concentration being in a range of 100 mg/dmto 300 mg/dm; immersing a substrate in the plating solution; and passing an electric current between an anode and the substrate, both immersed in the plating solution, thereby plating the substrate to form bumps.