The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 05, 2019

Filed:

Dec. 29, 2016
Applicants:

Fujikoshi Machinery Corp., Nagano, JP;

Kanazawa Institute of Technology, Ishikawa, JP;

Inventors:

Kazutaka Shibuya, Nagano, JP;

Jun Yanagisawa, Nagano, JP;

Yoshio Nakamura, Nagano, JP;

Michio Uneda, Ishikawa, JP;

Kenichi Ishikawa, Ishikawa, JP;

Assignees:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
B24B 49/18 (2006.01); B24B 37/005 (2012.01); B24B 53/007 (2006.01); B24B 53/017 (2012.01); B24B 37/20 (2012.01); B24B 37/04 (2012.01); B24B 53/06 (2006.01); B24B 53/08 (2006.01);
U.S. Cl.
CPC ...
B24B 37/20 (2013.01); B24B 37/005 (2013.01); B24B 37/042 (2013.01); B24B 49/18 (2013.01); B24B 53/007 (2013.01); B24B 53/017 (2013.01); B24B 53/06 (2013.01); B24B 53/08 (2013.01);
Abstract

The method of the present invention comprises the steps of: previously obtaining correlation data between surface properties of the polishing pad dressed under a plurality of stages of dressing conditions and polishing effects of the work polished by the polishing pad dressed under the dressing conditions; determining an assumed dressing condition capable of achieving an object polishing effect from the correlation data; dressing the polishing pad under the assumed dressing condition determined; polishing the work; cleaning the polishing pad which has been used for polishing the work; and measuring a surface property of the cleaned polishing pad.


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