The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 22, 2019
Filed:
Nov. 29, 2016
Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;
Kuei-Hsiung Cho, Xinpu Township, Hsinchu County, TW;
Shun-Chao Yang, Taichung, TW;
Ching-Wen Cheng, Zhubei, TW;
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD., Hsinchu, TW;
Abstract
A furnace for processing semiconductor wafers is provided. The furnace includes a tube having a closed upper end, an open lower end, and a sidewall connecting the upper end and the lower end. The furnace further includes a sealing lid removably connected to the lower end of the tube to define a reaction chamber. The furnace also includes an insulation cap connected to the sealing lid and positioned in the reaction chamber, and an opening is formed on a top surface of the insulation cap. In addition, the furnace includes a block member covering the opening and a wafer boat positioned on the top surface of the insulation cap.