The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 08, 2019

Filed:

Nov. 21, 2017
Applicant:

Texas Instruments Incorporated, Dallas, TX (US);

Inventors:

Osvaldo Jorge Lopez, Annandale, NJ (US);

Walter Hans Paul Schroen, Dallas, TX (US);

Jonathan Almeria Noquil, Bethlehem, PA (US);

Thomas Eugene Grebs, Bethlehem, PA (US);

Simon John Molloy, Allentown, PA (US);

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 25/16 (2006.01); H01L 31/028 (2006.01); H01L 31/042 (2014.01); H01L 31/0216 (2014.01); H01L 27/082 (2006.01); H01L 27/088 (2006.01); H01L 31/18 (2006.01); H01L 31/02 (2006.01); H01L 25/00 (2006.01); H01L 23/053 (2006.01); H01L 23/06 (2006.01); H01L 23/13 (2006.01); H01L 23/14 (2006.01); H01L 21/50 (2006.01); H01L 23/00 (2006.01); H01L 25/18 (2006.01); H01L 29/06 (2006.01); H01L 23/498 (2006.01);
U.S. Cl.
CPC ...
H01L 25/167 (2013.01); H01L 21/50 (2013.01); H01L 23/053 (2013.01); H01L 23/06 (2013.01); H01L 23/13 (2013.01); H01L 23/147 (2013.01); H01L 24/83 (2013.01); H01L 25/18 (2013.01); H01L 25/50 (2013.01); H01L 27/082 (2013.01); H01L 27/088 (2013.01); H01L 29/0657 (2013.01); H01L 31/02008 (2013.01); H01L 31/028 (2013.01); H01L 31/02168 (2013.01); H01L 31/042 (2013.01); H01L 31/1804 (2013.01); H01L 31/1868 (2013.01); H01L 23/49844 (2013.01); H01L 2224/83851 (2013.01); H01L 2924/01013 (2013.01); H01L 2924/01014 (2013.01); H01L 2924/01022 (2013.01); H01L 2924/01028 (2013.01); H01L 2924/01079 (2013.01); H01L 2924/04642 (2013.01); H01L 2924/04941 (2013.01); H01L 2924/05042 (2013.01); H01L 2924/05442 (2013.01); H01L 2924/10155 (2013.01); H01L 2924/1305 (2013.01); H01L 2924/13091 (2013.01); H01L 2924/1425 (2013.01); H01L 2924/1427 (2013.01); H01L 2924/15 (2013.01);
Abstract

A self-powered electronic system comprises a first chip () of single-crystalline semiconductor embedded in a second chip () of single-crystalline semiconductor shaped as a container bordered by ridges. The assembled chips are nested and form an electronic device assembled, in turn, in a slab of weakly p-doped low-grade silicon shaped as a container () bordered by ridges (). The flat side () of the slab includes a heavily n-doped region () forming a pn-junction () with the p-type bulk. A metal-filled deep silicon via () through the p-type ridge () connects the n-region with the terminal () on the ridge surface as cathode of the photovoltaic cell with the p-region as anode. The voltage across the pn-junction serves as power source of the device.


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