The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 01, 2019

Filed:

Mar. 31, 2015
Applicant:

Stmicroelectronics Pte Ltd, Singapore, SG;

Inventors:

Jing-En Luan, Shenzhen, CN;

Jerome Teysseyre, Ang Mo Kio, SG;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01V 8/00 (2006.01); G01S 17/02 (2006.01); H01L 25/16 (2006.01); G01S 7/481 (2006.01); H01L 31/173 (2006.01);
U.S. Cl.
CPC ...
G01S 17/026 (2013.01); G01S 7/4813 (2013.01); H01L 25/167 (2013.01); H01L 31/173 (2013.01); H01L 2224/16 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/92227 (2013.01); H01L 2224/97 (2013.01); H01L 2924/181 (2013.01);
Abstract

A proximity sensor includes a printed circuit board substrate, a semiconductor die, electrical connectors, a lens, a light emitting assembly, and an encapsulating layer. The semiconductor die is positioned over the printed circuit board substrate with its upper surface facing away from the printed circuit board substrate. Each of the electrical connectors is in electrical communication with a contact pad of the semiconductor die and a respective contact pad of the printed circuit board substrate. The lens is positioned over a sensor area of the semiconductor die. The light emitting assembly includes a light emitting device having a light emitting area, a lens positioned over the light emitting area, and contact pads facing the printed circuit board substrate. The encapsulating layer is positioned on the printed circuit board substrate, at least one of the electrical connectors, the semiconductor die, the lens, and the light emitting assembly.


Find Patent Forward Citations

Loading…