The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 01, 2019

Filed:

Aug. 08, 2017
Applicant:

Kla-tencor Corporation, Milpitas, CA (US);

Inventors:

Steve Zamek, Sunnyvale, CA (US);

David L. Brown, Los Gatos, CA (US);

Venkatraman Iyer, Sunnyvale, CA (US);

Assignee:

KLA-Tencor Corporation, Milpitas, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01N 21/95 (2006.01); G01T 1/24 (2006.01); H01L 27/146 (2006.01); H04N 5/372 (2011.01); H04N 5/225 (2006.01); H01J 37/28 (2006.01);
U.S. Cl.
CPC ...
G01N 21/9501 (2013.01); G01T 1/24 (2013.01); H01L 27/14618 (2013.01); H01L 27/14636 (2013.01); H04N 5/2256 (2013.01); H04N 5/37206 (2013.01); H01J 37/28 (2013.01); H01J 2237/2441 (2013.01); H01J 2237/2447 (2013.01); H04N 5/372 (2013.01);
Abstract

An imaging sensor assembly includes at least one substrate including a plurality of substrate signal lines. The imaging sensor assembly also includes at least one imaging sensor package disposed on the at least one substrate, the at least one imaging sensor package including at least one imaging sensor disposed on at least one imaging sensor package substrate. The imaging sensor assembly also includes at least one receiver package disposed on the at least one substrate, the receiver package including at least one receiver integrated circuit disposed on at least one receiver package substrate. The imaging sensor assembly also includes at least one electrical interconnect operably coupled to the at least one imaging sensor package and the at least one receiver package. A plurality of data signals are transmitted between the at least one imaging sensor package and the at least one receiver package via the at least one electrical interconnect.


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