The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 01, 2019
Filed:
Jan. 23, 2015
Kctech Co., Ltd., Anseong-si, KR;
Jang Kuk Kwon, Pyeongtaek-si, KR;
Chan Un Jeon, Suwon-di, KR;
Ki Hwa Jung, Cheongju-si, KR;
Jung Yoon Kim, Pyeongtaek-si, KR;
Nak Hyun Choi, Pohang-si, KR;
Seong Pyo Lee, Anseong-si, KR;
Bo Hyeok Choi, Yongin-si, KR;
KCTECH CO., LTD., Anseong-si, KR;
Abstract
The present invention relates to a method for preparing a slurry composition and a slurry composition prepared thereby, and has advantages of reducing scratches and residual particles, which are considered to be one of the biggest factors contributing to the decline in yield due to macroparticles and aggregated particles, while maintaining a high polishing rate, in a semiconductor CMP process. Furthermore, the present invention can achieve excellent results in the application to various patterns required in the ultra-large scale integration semiconductor process, the wafer non-uniformity (WIWNU) exhibiting a polishing rate, polishing selectivity, and polishing uniformity, which meet the needs, and the micro-scratch minimization.