The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 24, 2019

Filed:

Dec. 23, 2015
Applicant:

Intel Corporation, Santa Clara, CA (US);

Inventors:

Prashant Majhi, San Jose, CA (US);

Elijah V. Karpov, Portland, OR (US);

Ravi Pillarisetty, Portland, OR (US);

Uday Shah, Portland, OR (US);

Niloy Mukherjee, Portland, OR (US);

Assignee:

INTEL CORPORATION, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/24 (2006.01); H01L 45/00 (2006.01); G11C 11/16 (2006.01); H01L 27/22 (2006.01); H01L 43/02 (2006.01); H01L 43/10 (2006.01); G11C 13/00 (2006.01);
U.S. Cl.
CPC ...
H01L 27/2481 (2013.01); G11C 11/161 (2013.01); H01L 27/222 (2013.01); H01L 43/02 (2013.01); H01L 43/10 (2013.01); H01L 45/08 (2013.01); H01L 45/141 (2013.01); H01L 45/146 (2013.01); G11C 11/165 (2013.01); G11C 13/0021 (2013.01); G11C 2213/32 (2013.01); G11C 2213/71 (2013.01);
Abstract

A non-volatile memory device is disclosed, in which a ballast resistor layer is disposed between the selector element and memory element of a given memory cell of the device. The material composition of the ballast resistor can be customized, as desired, and in some cases may be, for example, a sub-stoichiometric oxide of hafnium oxide (HfO), tantalum oxide (TaO), or titanium dioxide (TiO), or an alloy of any thereof. In accordance with some embodiments, the integrated ballast resistor may serve the function of damping current surge related to the snapback characteristics of the selector element, preserving control of memory element switching. In accordance with some embodiments, an integrated ballast resistor layer provided as described herein may be implemented, for example, in any of a wide range of resistive random-access memory (RRAM) architectures and spin-transfer torque magnetic random-access memory (STTMRAM) architectures, including cross-point implementations of these types of architectures.


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