The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 24, 2019

Filed:

Nov. 09, 2017
Applicant:

Taiwan Semiconductor Manufacturing Co., Ltd., Hsin-Chu, TW;

Inventors:

Li-Wei Yin, Hsinchu, TW;

Shu-Yuan Ku, Hsinchu, TW;

Chun-Fai Cheng, Tin Shui Wai, HK;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/8238 (2006.01); H01L 29/66 (2006.01); H01L 27/092 (2006.01); H01L 27/11 (2006.01); H01L 21/8234 (2006.01); H01L 29/40 (2006.01); H01L 27/088 (2006.01);
U.S. Cl.
CPC ...
H01L 27/1116 (2013.01); H01L 21/823431 (2013.01); H01L 21/823481 (2013.01); H01L 27/1104 (2013.01); H01L 27/0886 (2013.01); H01L 29/401 (2013.01); H01L 29/66545 (2013.01);
Abstract

A method includes providing metal gate structures in a first and a second region, respectively, of a semiconductor substrate, simultaneously cutting the metal gate structures by a two-step etching process to form a first and a second trench in metal gate structures of the first and the second region, respectively, and filling each trench with an insulating material to form a first and a second gate isolation structure. Each step of the two-step etching process employs different etching chemicals and conditions. The metal gate structures in the first region and the second region differ in gate lengths and composition of gate electrode.


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