The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 24, 2019

Filed:

Jul. 07, 2017
Applicant:

Tokyo Electron Limited, Tokyo, JP;

Inventors:

Masataka Matsunaga, Koshi, JP;

Takahiro Masunaga, Koshi, JP;

Takashi Koga, Koshi, JP;

Yasuharu Iwashita, Koshi, JP;

Shingo Katsuki, Koshi, JP;

Masaaki Umitsuki, Koshi, JP;

Kazutoshi Ishimaru, Koshi, JP;

Fumio Sakata, Koshi, JP;

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/683 (2006.01); H01L 21/67 (2006.01); H01L 21/68 (2006.01); B29C 65/78 (2006.01); H01L 21/687 (2006.01);
U.S. Cl.
CPC ...
H01L 21/6838 (2013.01); H01L 21/67092 (2013.01); H01L 21/67103 (2013.01); H01L 21/67201 (2013.01); H01L 21/67248 (2013.01); H01L 21/68 (2013.01); H01L 21/681 (2013.01); H01L 21/68707 (2013.01); B29C 65/7802 (2013.01); Y10T 156/1744 (2015.01);
Abstract

A substrate transfer device for transferring a first substrate and a second substrate to a bonding apparatus configured to bond the first substrate and the second substrate, includes a first holding part configured to hold the first substrate from an upper surface side, a lower surface of the first substrate serving as a bonding surface, and a second holding part provided below the first holding part and configured to hold the second substrate from a lower surface side so that the second substrate faces the first substrate, a upper surface of the second substrate serving as a bonding surface to be bonded to the lower surface of the first substrate.


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