The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 17, 2019

Filed:

Apr. 12, 2018
Applicant:

Hitachi High-technologies Corporation, Tokyo, JP;

Inventors:

Naoyuki Kofuji, Tokyo, JP;

Ken'etsu Yokogawa, Tokyo, JP;

Nobuyuki Negishi, Tokyo, JP;

Masami Kamibayashi, Tokyo, JP;

Masatoshi Miyake, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01J 37/32 (2006.01);
U.S. Cl.
CPC ...
H01J 37/32165 (2013.01); H01J 37/32082 (2013.01); H01J 37/32192 (2013.01); H01J 37/32302 (2013.01); H01J 37/32449 (2013.01); H01J 37/3211 (2013.01); H01J 2237/006 (2013.01); H01J 2237/3341 (2013.01);
Abstract

In the plasma etching method, a sample is placed on a stage in a chamber. A first gas is introduced into the chamber. Electric field is supplied within the chamber to plasma is generated from the first gas. A first RF power of a first frequency, which is for generating a bias voltage in the sample for etching the sample with radicals which are generated in the plasma while the plasma is generated, is supplied to the stage. A second gas is introduced from a position in outer periphery of a surface of the stage, on which the sample is placed. A second RF power of a second frequency higher than the first frequency and capable of generating plasma from the second gas above the stage that allows radicals generated in the plasma generated from the second gas to be supplied in the outer periphery, is supplied to the stage.


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