The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 17, 2019
Filed:
Sep. 24, 2015
Shin-etsu Handotai Co., Ltd., Tokyo, JP;
Fujikoshi Machinery Corp., Nagano-shi, Nagano, JP;
Junichi Ueno, Shirakawa, JP;
Michito Sato, Nishigo-mura, JP;
Kaoru Ishii, Shirakawa, JP;
Hiromi Kishida, Chikuma, JP;
Yosuke Kanai, Nagano, JP;
Yuya Nakanishi, Nagano, JP;
SHIN-ETSU HANDOTAI CO., LTD., Tokyo, JP;
FUJIKOSHI MACHINERY CORP., Nagano-shi, JP;
Abstract
A polishing apparatus includes: a plurality of polishing heads for holding a wafer, a polishing pad for polishing the wafer, a rotatable turn table having the polishing pad attached thereto, a turn table driving mechanism for rotating the turn table, a plurality of wafer-detecting sensors for detecting coming off of the wafer from the polishing head during polishing, wherein the polishing apparatus has the wafer-detecting sensor disposed above peripheral portions of the respective polishing heads and on each downstream side in a rotation direction of the turn table with respect to the respective polishing heads. The polishing apparatus can detect coming off of a wafer from a polishing head during polishing more rapidly, and can prevent a breakage of the wafer thereby.