The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 17, 2019
Filed:
Oct. 22, 2018
Ebara Corporation, Tokyo, JP;
Masaya Seki, Tokyo, JP;
Manao Hoshina, Tokyo, JP;
Ebara Corporation, Tokyo, JP;
Abstract
The present invention relates to a polishing apparatus and a polishing method for polishing a substrate, such as a wafer, and more particularly to a polishing apparatus and a polishing method for polishing an edge portion of a wafer with use of a polishing tape. The polishing apparatus includes a substrate holder () configured to hold and rotate a substrate (W), and a polishing unit () configured to polish an edge portion of the substrate (W) with use of a polishing tape (). The polishing unit () includes: a disk head () having a circumferential surface for supporting the polishing tape (); and a head moving device () configured to move the disk head () in a tangential direction of the substrate (W) and to bring the polishing tape () on the circumferential surface of the disk head () into contact with the edge portion of the substrate (W).